Samsung introduces new line-up of LED components

Samsung Electronics company limited on Monday has introduced ‘Fx-CSP’ a line-up of LED packages which features chip-scale packaging and flexible circuit board technology, for use in automotive lighting applications.

“Our new Fx-CSP line-up will bring greater design flexibility and cost competitiveness to the automotive lighting industry,” said Jacob Tarn, executive vice president, LED Business Team, Samsung Electronics. He added that, “We will continue to introduce innovative LED products and technologies, such as multi-chip array technology, that can play a key role in the growth of the automotive LED lighting industry.”

Samsung’s new Fx-CSP provides an advanced combination of chip-scale packaging and flexible circuit board technology, which together enable more compact chip sizing and a higher degree of reliability. The use of a flexible circuit board also enables more heat to dissipate, which leads to lower resistance and brings about a greater degree of lumen-per-watt efficiency than using a ceramic board.